Part Number
Part Number:
NSN:
NIIN:
Item Name:
SEMICONDUCTOR DEVICE , PHOTO
Definition:
A SEMICONDUCTOR DEVICE (1) WHICH IS RESPONSIVE TO VISIBLE OR INFRARED RADIANT ENERGY. MAY OR MAY NOT INCLUDE MOUNTING HARDWARE AND/OR HEAT SINK. EXCLUDES SEMICONDUCTOR DEVICE (1), DIODE; SEMICONDUCTOR DEVICE (1), THYRISTOR AND TRANSISTOR. FOR SOLID STATE DEVICES WHICH EMIT VISIBLE OR INFRARED RADIANT ENERGY, SEE LIGHT EMITTING DIODE.
CAGE Information
| Code | Company |
|---|---|
| 28564 | REFAC ELECTRONICS CORP |
Federal Supply Class
Title
SEMICONDUCTOR DEVICES AND ASSOCI
Inclusions:
INCLUDES SEMICONDUCTOR ASSEMBLIES; SEMICONDUCTOR DIODES; SEMICONDUCTOR RECTIFIERS, SEMICONDUCTOR THYRISTORS; TRANSISTORS; UNITIZED SEMICONDUCTORS; ASSOCIATED HARDWARE EXCEPT SOCKETS.
Exclusions:
EXCLUDES MICROCIRCUITS; OPTOELECTRONIC DEVICES AND ASSOCIATED HARDWARE.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| AXGY | MOUNTING METHOD | TERMINAL |
| FEAT | SPECIAL FEATURES | MOUNTED IN A RED DIFFUSED PLASTICPACKAGE |
| ABBH | INCLOSURE MATERIAL | PLASTIC |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
| CTMZ | SEMICONDUCTOR MATERIAL | GALLIUM ARSENIDE PHOSPHIDE |